Semiconductor PKG Prototype Manual Mold Device Fusion-MEP30
Supports pressure reduction molding! Shortened processing time through design utilizing existing mold components.
The "Fusion-MEP30" is a mold device specialized for prototyping and experimentation. It allows for fine adjustments through transfer low-pressure control. An interactive condition setting screen is provided, enabling easy operation from the user's perspective via a 10-inch touch panel. Optionally, it can accommodate vacuum molding specifications. Please feel free to contact us when needed. 【Features】 ■ Plunger cleaning with one-touch operation ■ Addition of short shot mode ■ Support for vacuum molding specifications (optional) ■ Real-time monitoring of resin pressure with an internal pressure sensor (optional) ■ Multi-pot (2-5 POT) available for large modules (optional) *For more details, please refer to the PDF materials or feel free to contact us.
- Company：ローム・メカテック
- Price：10 million yen-50 million yen
